Simulation and fabrication of carbon nanotube–nanoparticle interconnected structures

Lu, Xiwen; Liu, Jinhang; Ding, Ye; Yang, Lijun; Yang, Zhan; Wang, Yang

With the rapid development of nanotechnology, the size of a device reaches sub-nanometer scale. The larger resistivity of interconnect leads to serious overheating of integrated circuits. Silicon-based electronic devices have also reached the physical limits of their development. The use of carbon nanotubes instead of traditional wires has become a new solution for connecting nano-structures. Nanocluster particles serving as brazing material play an important role in stabilizing the connection of carbon nanotubes, which places higher demands for nanoscale manipulation techniques. In this paper, the dynamic processes under different operating scenarios were simulated and analyzed, including probe propulsion nanoparticle operation, probe pickup nanoparticle operation and probe pickup nanocluster particle operation. Then, the SEM (Scanning Electron Microscope) was used for nanoparticle manipulation experiments. The smallest unit of carbon nanotube wire was obtained by three-dimensional (3D) construction of a carbon nanotube–silver nanocluster particle (CN-AgNP), which verified the feasibility of 3D manipulation of carbon nanotube wire construction. The experiments on the construction of carbon nanotube–nanocluster particle structures in three-dimensional operation were completed, and the smallest unit of carbon nanotube wire was constructed. This nano-fabrication technology will provide an efficient and mature technical means in the field of nano-interconnection.

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Lu, Xiwen / Liu, Jinhang / Ding, Ye / et al: Simulation and fabrication of carbon nanotube–nanoparticle interconnected structures. 2021. Copernicus Publications.

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