Temperature modeling and emulation of an ASIC temperature monitor system for Tightly-Coupled Processor Arrays (TCPAs)

Glocker, E.; Boppu, S.; Chen, Q.; Schlichtmann, U.; Teich, J.; Schmitt-Landsiedel, D.

This contribution provides an approach for emulating the behaviour of an ASIC temperature monitoring system (TMon) during run-time for a tightly-coupled processor array (TCPA) of a heterogeneous invasive multi-tile architecture to be used for FPGA prototyping. It is based on a thermal RC modeling approach. Also different usage scenarios of TCPA are analyzed and compared.

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Glocker, E. / Boppu, S. / Chen, Q. / et al: Temperature modeling and emulation of an ASIC temperature monitor system for Tightly-Coupled Processor Arrays (TCPAs). 2014. Copernicus Publications.

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